Isilungisi Sohlobo lwe-IGBT sokupholisa Umoya esingu-45V 2000A esingu-90KW se-Electroplating
isici
Imodeli Nedatha
| Inombolo yemodeli | I-ripple yokukhipha | Ukunemba kwesibonisi samanje | Ukunemba kokubonisa kwe-volt | Ukunemba kwe-CC/CV | Khuphuka bese wehla | Ukudubula ngokweqile |
| I-GKD45-2000CVC | I-VPP≤0.5% | ≤10mA | ≤10mV | ≤10mA/10mV | 0~99S | No |
Izinhlelo Zokusebenza Zomkhiqizo
Imboni Yesicelo: I-PCB Naked layer copper plating
Enqubweni yokukhiqiza i-PCB, ukugoba ngethusi okungenagesi kuyisinyathelo esibalulekile. Kusetshenziswa kabanzi kulezi zinqubo ezimbili ezilandelayo. Enye ukugoba nge-laminate engenalutho kanti enye ukugoba ngembobo, ngoba ngaphansi kwalezi zimo ezimbili, ukugoba nge-electroplating akukwazi noma akunakwenzeka. Enqubweni yokugoba nge-laminate engenalutho, amapuleti okugoba ngethusi angenagesi ungqimba oluncane lwethusi ku-substrate engenalutho ukwenza i-substrate ibe yi-conducting ukuze kuqhutshekwe nokugoba nge-electroplating. Enqubweni yokugoba ngembobo, ukugoba ngethusi okungenagesi kusetshenziselwa ukwenza izindonga zangaphakathi zembobo ziqhube ukuxhuma amasekethe aphrintiwe ngezendlalelo ezahlukene noma amaphini ama-chip ahlanganisiwe.
Umgomo wokufakwa kwethusi okungenagesi ukusebenzisa ukusabela kwamakhemikhali phakathi kwe-reducing agent kanye nosawoti wethusi esixazululweni esiwuketshezi ukuze i-ion yethusi incishiswe ibe yi-athomu yethusi. Ukusabela kufanele kuqhubeke ukuze ithusi elanele likwazi ukwakha ifilimu futhi limboze i-substrate.
Lolu chungechunge lwe-rectifier luklanyelwe ngokukhethekile i-PCB Naked layer copper plating, lusebenzisa usayizi omncane ukuze luthuthukise isikhala sokufakwa, amandla aphansi naphezulu angalawulwa ngokushintsha okuzenzakalelayo, ukupholisa umoya kusetshenziswa i-air duct ebiyelwe ezimele, ukulungiswa okuhambisanayo nokonga amandla, lezi zici ziqinisekisa ukunemba okuphezulu, ukusebenza okuzinzile kanye nokuthembeka.
Xhumana nathi
(Ungangena futhi bese ugcwalisa ngokuzenzakalelayo.)
