45V 2000A 90KW Air Cooling IGBT Type Rectifier for Electroplating

Incazelo Yomkhiqizo:

Imininingwane:

Amapharamitha okokufaka: Izigaba ezintathu ze-AC415V±10%, 50HZ

Amapharamitha okukhiphayo: DC 0~45V 0~2000A

Imodi yokuphumayo: Okukhiphayo okujwayelekile kwe-DC

Indlela yokupholisa: Ukupholisa umoya

Uhlobo lokuphakelwa kwamandla: I-IGBT-based High-frequency Power Supply

Thumela I-imeyili Kithi

Ukucaciswa
Uhlobo lwe-Faucet	Ompompi Bamasinki Bathroom,
Uhlobo Lokufaka	I-Centerset,
Ukufakwa Izimbobo	Umgodi owodwa,
Inombolo Yezibambo	Isibambo Single,
Qeda	Ti-PVD,
Isitayela	Izwe,
Isilinganiso sokugeleza	1.5 GPM (5.7 L/min) ubuningi,
Uhlobo Lwevalvu	I-Ceramic Valve,
Ukushintsha Okubandayo Nokushisayo	Yebo,
Ubukhulu
Ukuphakama Sekukonke	240 mm ( 9.5 "),
Ukuphakama kwe-Spout	155 mm ( 6.1 "),
Ubude be-Spout	160 mm ( 6.3 "),
Isikhungo sompompi	Imbobo Eyodwa,
Okubalulekile
Faucet Body Material	Ithusi,
I-Faucet Spout Material	Ithusi,
Impahla yesibambo se-Faucet	Ithusi,
Ulwazi Lwezesekeli
I-valve ifakiwe	Yebo,
I-Drain ifakiwe	Cha,
Izisindo
Isisindo Esiphelele (kg)	0.99,
Isisindo Sokuthumela (kg)	1.17,

Okokufaka Amapharamitha

Okokufaka kwe-AC 480v±10% Isigaba sesi-3
Okukhipha Amapharamitha

I-DC 0~50V 0~5000A ishintsheka ngokuqhubekayo
Amandla Okukhiphayo

250KW
Indlela Yokupholisa

ukupholisa umoya ngempoqo / ukupholisa amanzi
I-analogue ye-PLC

0-10V/ 4-20mA/ 0-5V
Isixhumi esibonakalayo

RS485/RS232
Imodi yokulawula

isilawuli kude design
Isibonisi Sesikrini

isibonisi sedijithali
Ukuvikela Okuningi

ukuntuleka kwesigaba sokushisa ngokweqile kwe-over-voltage over-current short circuit
Indlela Yokulawula

I-PLC/Microcontroller

Imodeli Nedatha

Inombolo yemodeli	Okukhiphayo ripple	Ukunemba kwesibonisi samanje	Ukunemba kwesibonisi se-Volt	Ukunemba kwe-CC/CV	I-Ramp-up kanye ne-ramp-down	Ukudubula ngokweqile
I-GKD45-2000CVC	I-VPP≤0.5%	≤10mA	≤10mV	≤10mA/10mV	0~99S	No

Izicelo Zomkhiqizo

Imboni Yohlelo Lokusebenza: PCB Ungqimba olunqunu lwe-copper Plating

Enqubweni yokukhiqiza ye-PCB, i-electroless copper plating iyisinyathelo esibalulekile. Isetshenziswa kabanzi kulezi zinqubo ezimbili ezilandelayo. Enye icwebezela phezu kwe-laminate engenalutho kanti enye icwebezela ngembobo, ngoba ngaphansi kwalezi zimo ezimbili, i-electroplating ayikwazi noma ngeke yenziwe. Enqubweni yokunamathisela ku-laminate engenalutho, amapuleti ethusi angenawo ugesi ungqimba oluncane lwethusi ku-substrate engenalutho ukwenza i-substrate iqhube ukuze kuqhutshekwe nokufakwa kukagesi. Enqubweni yokumboza ngembobo, i-electroless copper plating isetshenziselwa ukwenza izindonga zangaphakathi ze-hole conductive ukuxhuma amasekethe aphrintiwe ezendlalelo ezahlukene noma izikhonkwane zama-chips ahlanganisiwe.

Umgomo we-electroless copper deposition ukusebenzisa ukusabela kwamakhemikhali phakathi kwe-ejenti enciphisayo nosawoti wethusi esixazululweni esiwuketshezi ukuze i-ion yethusi incishiswe ibe i-athomu yethusi. Ukusabela kufanele kuqhubeke ukuze ithusi elanele lingakha ifilimu futhi limboze i-substrate.

Lolu chungechunge lwe-rectifier luklanyelwe ngokukhethekile i-PCB yokucwenga yethusi yongqimba olunqunu, ithathe usayizi omncane ukuze kulungiswe indawo yokufaka, okwamanje okuphansi nokuphezulu kungalawulwa ngokushintsha okuzenzakalelayo, ukupholisa komoya kusetshenziswa ipayipi lomoya elivalekile elizimele, ukulungiswa okuhambisanayo nokonga amandla, lezi zici ziqinisekisa ukunemba okuphezulu, ukusebenza okuzinzile nokwethembeka.