| Inombolo yemodeli | I-ripple yokukhipha | Ukunemba kwesibonisi samanje | Ukunemba kokubonisa kwe-volt | Ukunemba kwe-CC/CV | Khuphuka bese wehla | Ukudubula ngokweqile |
| I-GKD15-300CVC | I-VPP≤0.5% | ≤10mA | ≤10mV | ≤10mA/10mV | 0~99S | No |
I-electroplate yokwelapha ebusweni ye-chrome, igolide, isiliva, i-nickel, i-zinc, insimbi, ibhodi le-PCB njll.
Ukufakwa kwethusi: ukufakelwa i-primer, ukuthuthukisa ikhono lokunamathela kungqimba lokufakwa kwethusi, kanye nekhono lokumelana nokugqwala. (Ithusi kulula ukulifaka i-oxidation, i-oxidation, ithusi eliluhlaza alisakwazi ukudonsa amanzi, ngakho-ke imikhiqizo efakwe ithusi kumele ivikele ithusi)
I-Nickel plating: i-priming noma ukubukeka, ukuthuthukisa ukumelana nokugqwala kanye nokumelana nokuguguleka, (lapho i-nickel yamakhemikhali isetshenziswa khona enkambisweni yesimanje yokumelana nokuguguleka kune-chrome plating). (Qaphela ukuthi imikhiqizo eminingi ye-elekthronikhi, njenge-DIN head, i-N head, ayisasebenzisi i-nickel priming, ikakhulukazi ngoba i-nickel inamandla kazibuthe, izothinta izakhiwo zikagesi ngaphakathi kwe-intermodulation engasebenzi)
(Ungangena futhi bese ugcwalisa ngokuzenzakalelayo.)