Inombolo yemodeli | Okukhiphayo ripple | Ukunemba kwesibonisi samanje | Ukunemba kwesibonisi se-Volt | Ukunemba kwe-CC/CV | I-Ramp-up kanye ne-ramp-down | Ukudubula ngokweqile |
I-GKD15-300CVC | I-VPP≤0.5% | ≤10mA | ≤10mV | ≤10mA/10mV | 0~99S | No |
I-Surface yokwelapha i-electroplate ye-chrome, igolide, isiliva, i-nickel, i-zinc, insimbi, ibhodi le-PCB nokunye.
I-Copper Plating: i-priming, ithuthukisa ikhono lokunamathela kungqimba lokucwenga, kanye nekhono lokumelana nokugqwala. (I-Copper ilula ukwenza i-oxidation, i-oxidation, i-copper green ayisahambisani, ngakho-ke imikhiqizo ehlanganiswe ngethusi kufanele ivikele ithusi)
I-Nickel plating: ukuqala noma ukubukeka, ukuthuthukisa ukumelana nokugqwala nokumelana nokuguga, (lapho ikhemikhali ye-nickel yenqubo yesimanje yokumelana nokuguga kune-chrome plating). (Qaphela ukuthi imikhiqizo eminingi ye-elekthronikhi, njengekhanda le-DIN, ikhanda le-N, alisasebenzisi i-nickel priming, ikakhulukazi ngenxa yokuthi i-nickel inozibuthe, izothinta izici zikagesi ngaphakathi kwe-intermodulation ye-passive)
(Ungakwazi futhi Ngena futhi ugcwalise ngokuzenzakalelayo.)