Ukugoba ngensimbi kuyinqubo ehilela ukufaka ungqimba lwensimbi phezu kobuso benye into. Lokhu kwenziwa ngezinhloso ezahlukahlukene, okuhlanganisa ukuthuthukisa ukubukeka, ukuthuthukisa ukumelana nokugqwala, ukunikeza ukumelana nokuguguleka, kanye nokwenza kube lula ukuqhuba kahle. Kunezinhlobo eziningana ezahlukene zamasu okugoba ngensimbi, ngayinye inezinhlelo zayo ezihlukile kanye nezinzuzo. Nazi ezinye zezinhlobo ezivame kakhulu:
Ukufaka i-Electroplating: Ukufaka i-Electroplating kuyindlela yokubeka insimbi esetshenziswa kakhulu. Kuhilela ukucwilisa into ezofakwa i-substrate (i-substrate) esixazululweni esiqukethe ama-ion ensimbi ezinto zokufaka i-plating. Kudlula ugesi oqondile ngesisombululo, okwenza ama-ion ensimbi anamathele ebusweni be-substrate, kwakha ungqimba lwensimbi olufanayo nolunamathelayo. Ukufaka i-Electroplating kusetshenziswa ezimbonini ezahlukahlukene, okuhlanganisa izimoto, izinto zikagesi, kanye nobucwebe, ngezinjongo zokuhlobisa nokusebenza.
I-Electroless Plating: Ngokungafani ne-electroplating, i-electroless plating ayidingi ugesi wangaphandle. Esikhundleni salokho, ukusabela kwamakhemikhali phakathi kwe-reducing agent nama-ion ensimbi esixazululweni kubeka insimbi ku-substrate. I-electroless plating yaziwa ngekhono layo lokumboza izimo eziyinkimbinkimbi kanye nezindawo ezingezona ezihambisa ugesi. Ivame ukusetshenziswa ekukhiqizweni kwamabhodi wesekethe aphrintiwe (ama-PCB) kanye nasezimbonini lapho kudingeka khona ukulawulwa kobukhulu obuqondile.
Ukucwilisa: Ukucwilisa kuyindlela elula ehilela ukucwilisa i-substrate esixazululweni esiqukethe usawoti wensimbi. Ama-ion ensimbi esixazululweni anamathela ebusweni be-substrate, akha ungqimba oluncane lwensimbi efiselekayo. Le nqubo ivame ukusetshenziselwa ukusetshenziswa kwezinga elincane kanye nesinyathelo sangaphambi kokwelashwa kwezinye izinqubo zokucwilisa.
Ukususwa Kwe-Vacuum (PVD kanye ne-CVD): Ukususwa Komusi Ongokoqobo (PVD) kanye Nokususwa Komusi Wekhemikhali (CVD) yizindlela ezisetshenziswa ukufaka amafilimu ensimbi amancane kuma-substrate endaweni ye-vacuum. I-PVD ihilela ukuhwamuka kwensimbi ekamelweni le-vacuum, kulandelwe ukufakwa kwayo ebusweni be-substrate. I-CVD, ngakolunye uhlangothi, isebenzisa ukusabela kwamakhemikhali ukudala uqweqwe lwensimbi. Lezi zindlela zisetshenziswa embonini ye-semiconductor, i-optics, kanye ne-decorative coating.
Uku-Anodizing: Uku-Anodizing uhlobo oluthile lwe-electrochemical plating olusetshenziswa kakhulu ku-aluminium kanye ne-alloys yayo. Kuhilela ukudala ungqimba lwe-oxide olulawulwayo ebusweni bensimbi. Uku-Anodizing kunikeza ukumelana nokugqwala okuthuthukisiwe, ukumelana nokuguguleka okuthuthukisiwe, futhi kungasetshenziswa ngezinjongo zokuhlobisa.
Ukuhlanganisa i-Galvanization: Ukuhlanganisa i-Galvanization kuhilela ukumboza insimbi noma insimbi ngesendlalelo se-zinc ukuvikela ukugqwala. Indlela evame kakhulu ukusebenzisa i-hot-dip galvanization, lapho i-substrate ifakwa khona ku-zinc encibilikisiwe. Ukuhlanganisa i-Galvanization kusetshenziswa kabanzi embonini yokwakha nezimoto.
Ukugoqwa Kwethini: Ukugoqwa kwethini kusetshenziselwa ukuvikela ekugqwaleni, ukuthuthukisa ukushintshwa kwensimbi, nokunikeza ukubukeka okukhanyayo nokucwebezelayo. Kuvame ukusetshenziswa embonini yokupakisha ukudla (amathini) kanye ne-elekthronikhi.
I-Gold Plating: I-Gold Plating inikeza ukumelana okuhle kakhulu nokugqwala, ukuhanjiswa kukagesi, kanye nokukhanga kobuhle. Ivame ukusetshenziswa embonini ye-elekthronikhi, ikakhulukazi ezixhumini nasezixhumeni.
I-Chrome Plating: I-Chrome plating yaziwa ngezakhiwo zayo zokuhlobisa nokumelana nokugqwala. Ivame ukusetshenziswa embonini yezimoto neyokugezela.
Uhlobo ngalunye lokufaka insimbi lunezinzuzo zalo kanye nokusetshenziswa okuthile, okwenza kube yizinqubo ezibalulekile ezimbonini ezahlukene. Ukukhetha indlela yokufaka insimbi kuncike ezicini ezifiselekayo zomkhiqizo oqediwe kanye nezinto ezihilelekile.
Isikhathi sokuthunyelwe: Septhemba-07-2023
