Izinhlobo ezahlukene ze-Metal Plating

I-Metal Plating yinqubo ehlanganisa ukufaka ungqimba lwensimbi phezu kwenye into. Lokhu kwenzelwa izinhloso ezehlukene, okuhlanganisa ukuthuthukisa ukubukeka, ukuqinisa ukumelana nokugqwala, ukuhlinzeka ukumelana nokugqokwa, kanye nokwenza kube ngcono ukusebenza kahle. Kunezinhlobo eziningana ezahlukene zamasu okucwenga ensimbi, ngayinye inezinhlelo zayo ezihlukile kanye nezinzuzo zayo. Nazi ezinye zezinhlobo ezivame kakhulu:

I-Electroplating: I-Electroplating iyindlela esetshenziswa kakhulu yokuhlanganisa insimbi. Kubandakanya ukucwiliswa kwento ezogqitshwa (i-substrate) ibe isixazululo esiqukethe ama-ion ensimbi wento yokucwenga. I-current eqondile idluliswa ngesisombululo, okwenza ama-ion ensimbi abambelele endaweni ye-substrate, enze umfaniswano kanye ne-adherent metal coating. I-Electroplating isetshenziswa ezimbonini ezahlukahlukene, kufaka phakathi ezezimoto, ze-elekthronikhi, nobucwebe, ngezinjongo zokuhlobisa nokusebenza.

I-Electroless Plating: Ngokungafani ne-electroplating, ukufakwa kwe-electroless akudingi umbane wangaphandle kagesi. Kunalokho, ukusabela kwamakhemikhali phakathi kwe-ejenti enciphisayo nama-ion ensimbi esixazululweni kubeka insimbi ku-substrate. I-Electroless plating iyaziwa ngekhono layo lokumboza ubujamo obuyinkimbinkimbi kanye nezindawo ezingezona ezi-conductive. Ivamise ukusetshenziswa ekukhiqizweni kwamabhodi esekethe aphrintiwe (ama-PCB) nasezimbonini lapho kudingeka khona ukulawula ukujiya okunembayo.

I-Immersion Plating: Ukucwiliswa kokucwiliswa kuyindlela elula ehlanganisa ukucwilisa i-substrate esixazululweni esiqukethe usawoti wensimbi. Ama-ion ensimbi esixazululweni anamathela ebusweni be-substrate, enza ungqimba oluncane lwensimbi oyifunayo. Le nqubo ivamise ukusetshenziselwa izicelo ezincane futhi njengesinyathelo sokwelashwa kwangaphambili kwezinye izinqubo zokucwenga.

I-Vacuum Deposition (i-PVD ne-CVD): I-Physical Vapor Deposition (PVD) kanye ne-Chemical Vapor Deposition (CVD) izindlela ezisetshenziselwa ukufaka amafilimu ensimbi azacile kuma-substrates endaweni yevacuum. I-PVD ihilela ukuhwamuka kwensimbi egumbini le-vacuum, okulandelwa ukubekwa kwayo endaweni engaphansi. I-CVD, ngakolunye uhlangothi, isebenzisa ukusabela kwamakhemikhali ukuze yenze i-coating yensimbi. Lezi zindlela zisetshenziswa embonini ye-semiconductor, optics, kanye nezingubo zokuhlobisa.

I-Anodizing: I-anodizing uhlobo oluthile lwe-electrochemical plating esetshenziswa ikakhulukazi ku-aluminium nama-alloys ayo. Kuhilela ukudala ungqimba lwe-oxide olulawulwayo endaweni yensimbi. I-Anodizing inikeza ukumelana nokugqwala okuthuthukisiwe, ukumelana nokuguga okuthuthukisiwe, futhi ingasetshenziselwa izinjongo zokuhlobisa.

I-Galvanization: I-galvanization ihilela ukumboza insimbi noma insimbi ngongqimba lwezinc ukuvikela ekugqwaleni. Indlela evamile kakhulu i-hot-dip galvanization, lapho i-substrate icwiliswa ku-zinc encibilikisiwe. I-galvanization isetshenziswa kakhulu ezimbonini zokwakha nezezimoto.

I-Tin Plating: I-tin plating isetshenziselwa ukuvikela ekugqwaleni, ukuthuthukisa ukubola, nokuhlinzeka ngokubukeka okukhanyayo, okucwebezelayo. Kuvame ukusetshenziswa embonini yokupakisha ukudla (amathini amathini) kanye ne-electronics.

I-Gold Plating: Ukufakwa kwegolide kunikeza ukumelana nokugqwala okuhle kakhulu, ukuqhutshwa kukagesi, kanye nokukhanga kobuhle. Ivame ukusetshenziswa embonini ye-elekthronikhi, ikakhulukazi izixhumi noxhumana nabo.

I-Chrome Plating: I-Chrome plating yaziwa ngezinto zayo zokuhlobisa nezimelana nokugqwala. Isetshenziswa kakhulu embonini yezimoto neyokugeza.

Uhlobo ngalunye lwe-metal plating lunezinzuzo zalo kanye nokusebenza okuqondile, okulwenza lube yizinqubo ezibalulekile ezimbonini ezihlukahlukene. Ukukhethwa kwendlela yokugcoba kuncike ezintweni ezifunwayo zomkhiqizo oqediwe kanye nezinto ezihilelekile.